"Thermal brings security: A roadmap to mitigate silicon bias influence for ..."

Wei He (2016)

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DOI: 10.1109/ISICIR.2016.7829741

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-19

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Wei He:
Thermal brings security: A roadmap to mitigate silicon bias influence for symmetric dual-rail logic. ISIC 2016: 1-4

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