"IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face ..."

Zixian Yang et al. (2026)

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DOI: 10.1145/3764386.3779590

access: closed

type: Conference or Workshop Paper

metadata version: 2026-03-31

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Zixian Yang, Shanyi Li, Leilei Jin, Tsung-Yi Ho, Chien-Nan Jimmy Liu:
IDDA-3D: Inter-Die Delay Aware Timing-Driven Placement on Face-to-Face Bonded 3D ICs. ISPD 2026: 11-19

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