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"On temperature planarization effect of copper dummy fills in deep ..."

Basab Datta, Wayne P. Burleson (2009)

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DOI: 10.1109/ISQED.2009.4810344

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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  persistent URL:
  - https://dblp.org/rec/conf/isqed/DattaB09
Basab Datta, Wayne P. Burleson:
On temperature planarization effect of copper dummy fills in deep nanometer technology. ISQED 2009: 494-499

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