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"22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension ..."

Chi-Sung Oh et al. (2020)

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DOI: 10.1109/ISSCC19947.2020.9063110

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-11

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  dblp key:
  - conf/isscc/OhCBKKRPKCSLSHC20
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  persistent URL:
  - https://dblp.org/rec/conf/isscc/OhCBKKRPKCSLSHC20
Chi-Sung Oh, Ki Chul Chun, Young-Yong Byun, Yong-Ki Kim, So-Young Kim, Yesin Ryu, Jaewon Park, Sinho Kim, Sang-uhn Cha, Dong-Hak Shin, Jungyu Lee, Jong-Pil Son, Byung-Kyu Ho, Seong-Jin Cho, Beomyong Kil, Sungoh Ahn, Baekmin Lim, Yong-Sik Park, Kijun Lee, Myung-Kyu Lee, Seungduk Baek, Junyong Noh, Jae-Wook Lee, Seungseob Lee, Sooyoung Kim, Bo-Tak Lim, Seouk-Kyu Choi, Jin-Guk Kim, Hye-In Choi, Hyuk-Jun Kwon, Jun Jin Kong, Kyomin Sohn, Nam Sung Kim, Kwang-Il Park, Jung-Bae Lee:
22.1 A 1.1V 16GB 640GB/s HBM2E DRAM with a Data-Bus Window-Extension Technique and a Synergetic On-Die ECC Scheme. ISSCC 2020: 330-332

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