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"Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test."
Kele Shen, Dong Xiang, Zhou Jiang (2014)
- Kele Shen, Dong Xiang, Zhou Jiang:
Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test. ISVLSI 2014: 208-213
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