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"Post-silicon tuning aware wafer matching algorithm for 3d integration of ICs."

Sangdo Park, Taewhan Kim (2014)

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DOI: 10.1109/MWSCAS.2014.6908464

access: closed

type: Conference or Workshop Paper

metadata version: 2020-03-27

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  dblp key:
  - conf/mwscas/ParkK14
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Sangdo Park, Taewhan Kim:
Post-silicon tuning aware wafer matching algorithm for 3d integration of ICs. MWSCAS 2014: 511-514

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