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"Fabrication of through-silicon vias (TSV) by nickel electroplating in ..."

Ho-Chiao Chuang et al. (2014)

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DOI: 10.1109/NEMS.2014.6908770

access: closed

type: Conference or Workshop Paper

metadata version: 2023-01-24

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  - conf/nems/ChuangLHLY14
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Ho-Chiao Chuang, Wei-Hong Lai, Chih-Chung Huang, Ai-Ho Liao, Chih-Kuang Yeh:
Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. NEMS 2014: 108-112

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