"A silicon metamaterial chip-to-chip coupler for photonic flip-chip ..."

Tymon Barwicz et al. (2017)

> Home

Details and statistics

DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-11

- view
  - electronic edition @ ieee.org
- export record
  dblp key:
  - conf/ofc/BarwiczKMBE17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ofc/BarwiczKMBE17
Tymon Barwicz, Swetha Kamlapurkar, Yves Martin, Robert L. Bruce, Sebastian Engelmann:
A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications. OFC 2017: 1-3

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.