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"RESIN: A Holistic Service for Dealing with Memory Leaks in Production ..."

Chang Lou et al. (2022)

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DOI: —

access: open

type: Conference or Workshop Paper

metadata version: 2022-10-11

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  - electronic edition @ usenix.org (open access)
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  dblp key:
  - conf/osdi/LouC0DQYLLC22
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  persistent URL:
  - https://dblp.org/rec/conf/osdi/LouC0DQYLLC22
Chang Lou, Cong Chen, Peng Huang, Yingnong Dang, Si Qin, Xinsheng Yang, Xukun Li, Qingwei Lin, Murali Chintalapati:
RESIN: A Holistic Service for Dealing with Memory Leaks in Production Cloud Infrastructure. OSDI 2022: 109-125

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