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"Chip-embedded Glass Interposer for 5G Applications."
Xingchen Li et al. (2023)
- Xingchen Li
, Xiaofan Jia, Kyoung-sik Moon, Joon Woo Kim, Aadit Pandey, Anthony Chiu, Andrew Kenerson, Madhavan Swaminathan:
Chip-embedded Glass Interposer for 5G Applications. RWS 2023: 129-131
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