"3D stacked embedded component system-in-package for wearable electronic ..."

Vijay N. Nair et al. (2017)

> Home

Details and statistics

DOI: 10.1109/RWS.2017.7885959

access: closed

type: Conference or Workshop Paper

metadata version: 2019-06-18

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/rws/NairKSEFB17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/rws/NairKSEFB17
Vijay N. Nair, L. Krishnamurthy, Johanna Swan, A. Essaian, Torrey W. Frank, Michael Bynum:
3D stacked embedded component system-in-package for wearable electronic devices. RWS 2017: 108-110

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.