"Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs."

Pei-An Ho et al. (2019)

> Home

Details and statistics

DOI: 10.1109/SOCC46988.2019.1570544200

access: closed

type: Conference or Workshop Paper

metadata version: 2020-05-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/socc/HoCWH19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/socc/HoCWH19
Pei-An Ho, Yen-Hao Chen, Allen C.-H. Wu, TingTing Hwang:
Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs. SoCC 2019: 236-241

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.