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"REVaMP2 Project: Towards Round-Trip Engineering of Software Product Lines ..."

Andrey Sadovykh et al. (2019)

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DOI: 10.1007/978-3-030-29852-4_34

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/tools/SadovykhZBBSRMG19
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  - https://dblp.org/rec/conf/tools/SadovykhZBBSRMG19
Andrey Sadovykh, Tewfik Ziadi, Alessandra Bagnato, Thorsten Berger, Jan-Philipp Steghöfer, Jacques Robin, Raúl Mazo, Elena Gallego:
REVaMP2 Project: Towards Round-Trip Engineering of Software Product Lines - Approach, Intermediate Results and Challenges. TOOLS 2019: 406-417

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