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"Post-bond Stack Testing for 3D Stacked IC."

Surajit Kumar Roy et al. (2012)

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DOI: 10.1007/978-3-642-31494-0_8

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-22

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  dblp key:
  - conf/vdat/RoyRGR12
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  - https://dblp.org/rec/conf/vdat/RoyRGR12
Surajit Kumar Roy, Dona Roy, Chandan Giri, Hafizur Rahaman:
Post-bond Stack Testing for 3D Stacked IC. VDAT 2012: 59-68

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