"Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)."

Eric Beyne, Anne Jourdain, Gerald Beyer (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185227

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-28

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Eric Beyne, Anne Jourdain, Gerald Beyer:
Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN). VLSI Technology and Circuits 2023: 1-2

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