"Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN)."

Eric Beyne, Anne Jourdain, Gerald Beyer (2023)

Details and statistics

DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185227

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-28