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"Electrical and Thermal Analysis for System-in-a-Package (SiP) ..."

Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai (2003)

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DOI: 10.1109/ISQED.2003.1194736

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-23

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Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming Dai:
Electrical and Thermal Analysis for System-in-a-Package (SiP) Implementation Platform. ISQED 2003: 229-234

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