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"3D volumetric ultrasound imaging with a 32×32 CMUT array integrated ..."

Anshuman Bhuyan et al. (2013)

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DOI: 10.1109/ISSCC.2013.6487786

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Anshuman Bhuyan, Jung Woo Choe, Byung-chul Lee, Ira O. Wygant, Amin Nikoozadeh, Ömer Oralkan, Butrus T. Khuri-Yakub:
3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology. ISSCC 2013: 396-397

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