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"Innovative structures to test bonding alignment and characterize high ..."

Imed Jani et al. (2017)

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DOI: 10.1109/NEWCAS.2017.8010128

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

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  dblp key:
  - conf/newcas/JaniLVB17
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Imed Jani, Didier Lattard, Pascal Vivet, Edith Beigné:
Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC. NEWCAS 2017: 153-156

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