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"Toward quantifying the IC design value of interconnect technology ..."

Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li (2013)

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DOI: 10.1109/SLIP.2013.6681680

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li:
Toward quantifying the IC design value of interconnect technology improvements. SLIP 2013: 1-6

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