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"Improved 3LIN Hardness via Linear Label Cover."

Prahladh Harsha et al. (2019)

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DOI: —

access: open

type: Informal or Other Publication

metadata version: 2022-09-27

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  - electronic edition @ weizmann.ac.il (open access)
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  dblp key:
  - journals/eccc/HarshaKLT19
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  persistent URL:
  - https://dblp.org/rec/journals/eccc/HarshaKLT19
Prahladh Harsha, Subhash Khot, Euiwoong Lee, Devanathan Thiruvenkatachari:
Improved 3LIN Hardness via Linear Label Cover. Electron. Colloquium Comput. Complex. TR19 (2019)

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