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"Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder ..."

Jinglin Bi et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.09.028

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao:
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. Microelectron. Reliab. 51(3): 636-641 (2011)

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