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"Impact of probing procedure on flip chip reliability."

Kuo-Ming Chen, Kuo-Ning Chiang (2003)

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DOI: 10.1016/S0026-2714(02)00267-6

access: closed

type: Journal Article

metadata version: 2022-10-02

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Kuo-Ming Chen, Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability. Microelectron. Reliab. 43(1): 123-130 (2003)

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