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"Non-destructive imaging of defects in Ag-sinter die attach layers - A ..."

Patrick Dreher et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.121

access: closed

type: Journal Article

metadata version: 2023-03-31

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Patrick Dreher, Roman Schmidt, A. Vetter, J. Hepp, Karl Aberer, Christoph J. Brabec:
Non-destructive imaging of defects in Ag-sinter die attach layers - A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography. Microelectron. Reliab. 88-90: 365-370 (2018)

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