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"Quantification of creep strain in small lead-free solder joints with the ..."

Li Jiang et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.08.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Li Jiang, Keling Yang, Jiemin Zhou, Ke Xiang, Wenjie Wang:
Quantification of creep strain in small lead-free solder joints with the in situ micro electronic-resistance measurement. Microelectron. Reliab. 48(3): 438-444 (2008)

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