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"Effect of Joule heating on the reliability of solder joints under power ..."

Jie Mei et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.053

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mr/MeiHLGZ18
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  - https://dblp.org/rec/journals/mr/MeiHLGZ18
Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann:
Effect of Joule heating on the reliability of solder joints under power cycling conditions. Microelectron. Reliab. 88-90: 684-690 (2018)

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