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"Mechanical and electrical characterisation of Au wire interconnects in ..."

Maria Mirgkizoudi et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.02.023

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/MirgkizoudiLCR15
Maria Mirgkizoudi, Changqing Liu, Paul P. Conway, Steve Riches:
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions. Microelectron. Reliab. 55(6): 952-960 (2015)

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