"Enhancing bondability with coated copper bonding wire."

Tomohiro Uno (2011)

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DOI: 10.1016/J.MICROREL.2010.04.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tomohiro Uno:
Enhancing bondability with coated copper bonding wire. Microelectron. Reliab. 51(1): 88-96 (2011)

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