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"Real-Time Aging Monitoring for IGBT Modules Using Case Temperature."

Ze Wang et al. (2016)

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DOI: 10.1109/TIE.2015.2497665

access: closed

type: Journal Article

metadata version: 2020-05-22

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Ze Wang, Bo Tian, Wei Qiao, Liyan Qu:
Real-Time Aging Monitoring for IGBT Modules Using Case Temperature. IEEE Trans. Ind. Electron. 63(2): 1168-1178 (2016)

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