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"H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs."

Hai-Bao Chen et al. (2015)

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DOI: 10.1145/2714563

access: closed

type: Journal Article

metadata version: 2018-11-06

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  - https://dblp.org/rec/journals/todaes/ChenLTHWW15
Hai-Bao Chen, Ying-Chi Li, Sheldon X.-D. Tan, Xin Huang, Hai Wang, Ngai Wong:
H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICs. ACM Trans. Design Autom. Electr. Syst. 20(4): 47:1-47:25 (2015)

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