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"Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching."

Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen (2015)

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DOI: 10.1145/2699832

access: closed

type: Journal Article

metadata version: 2024-02-05

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  - https://dblp.org/rec/journals/todaes/TaouilHM15
Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen:
Yield Improvement for 3D Wafer-to-Wafer Stacked ICs Using Wafer Matching. ACM Trans. Design Autom. Electr. Syst. 20(2): 19:1-19:23 (2015)

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