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"TSV Prebond Test Method Based on Switched Capacitors."

Xu Fang, Yang Yu, Xiyuan Peng (2019)

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DOI: 10.1109/TVLSI.2018.2870482

access: closed

type: Journal Article

metadata version: 2020-07-30

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Xu Fang, Yang Yu, Xiyuan Peng:
TSV Prebond Test Method Based on Switched Capacitors. IEEE Trans. Very Large Scale Integr. Syst. 27(1): 205-218 (2019)

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