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"Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio ..."

Yun Chen et al. (2020)

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DOI: 10.1109/ACCESS.2020.3037338

access: open

type: Journal Article

metadata version: 2023-09-30

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Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Ching-Ping Wong:
Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging. IEEE Access 8: 206571-206580 (2020)

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