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"Through-Glass Vias for Glass Interposers and MEMS Packaging Applications ..."

Miku J. Laakso et al. (2018)

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DOI: 10.1109/ACCESS.2018.2861886

access: open

type: Journal Article

metadata version: 2023-02-17

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Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Göran Stemme, Thorbjorn Ebefors, Frank Niklaus:
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires. IEEE Access 6: 44306-44317 (2018)

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