"Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using ..."

Hongyu Tang et al. (2017)

> Home

Details and statistics

DOI: 10.1109/ACCESS.2017.2737638

access: open

type: Journal Article

metadata version: 2021-03-22

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/access/TangYCQFZ17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/access/TangYCQFZ17
Hongyu Tang, Huaiyu Ye, Xianping Chen, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm. IEEE Access 5: 16459-16468 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.