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"Ranking process parameter association with low yield wafers using spec-out ..."

Jiwon Yang et al. (2017)

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DOI: 10.1016/J.CIE.2017.09.036

access: closed

type: Journal Article

metadata version: 2022-12-27

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  - https://dblp.org/rec/journals/candie/YangLKCLP17
Jiwon Yang, Seung-kyung Lee, Seokho Kang, Sungzoon Cho, Young-Hak Lee, Hae-Sang Park:
Ranking process parameter association with low yield wafers using spec-out event network analysis. Comput. Ind. Eng. 113: 419-424 (2017)

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