"A bond-based linear peridynamic model for viscoelastic materials and its ..."

Zhiwei Yang et al. (2025)

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DOI: 10.1016/J.CAMWA.2025.01.024

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type: Journal Article

metadata version: 2025-10-14

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Zhiwei Yang, Jie Ma, Ning Du, Hong Wang:
A bond-based linear peridynamic model for viscoelastic materials and its efficient collocation method. Comput. Math. Appl. 183: 121-136 (2025)

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