Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D ..."

Tae Woo Hong, Connor Myant, David E. Boyle (2020)

> Home

Details and statistics

DOI: —

access: open

type: Informal or Other Publication

metadata version: 2021-05-17

- view
  - electronic edition @ arxiv.org (open access)
- export record
  dblp key:
  - journals/corr/abs-2011-06473
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2011-06473
Tae Woo Hong, Connor Myant, David E. Boyle:
Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending. CoRR abs/2011.06473 (2020)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.