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"High-Throughput Hardware Design for 3D-HEVC Disparity Estimation."

Murilo R. Perleberg et al. (2020)

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DOI: 10.1109/MDAT.2019.2932938

access: closed

type: Journal Article

metadata version: 2020-07-15

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  - journals/dt/PerlebergSAAZPC20
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  - https://dblp.org/rec/journals/dt/PerlebergSAAZPC20
Murilo R. Perleberg, Altamiro Amadeu Susin, Vladimir Afonso, Luciano Agostini, Bruno Zatt, Marcelo Schiavon Porto, Ruhan A. Conceição:
High-Throughput Hardware Design for 3D-HEVC Disparity Estimation. IEEE Des. Test 37(3): 22-29 (2020)

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