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"Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs ..."

Dae Hyun Kim, Sung Kyu Lim (2012)

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DOI: 10.1109/JETCAS.2012.2193840

access: closed

type: Journal Article

metadata version: 2022-10-02

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Dae Hyun Kim, Sung Kyu Lim:
Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(2): 240-248 (2012)

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