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"Fabrication and characterization of robust through-silicon vias for ..."
Paul S. Andry et al. (2008)
- Paul S. Andry, Cornelia K. Tsang, Bucknell C. Webb, Edmund J. Sprogis, Steven L. Wright, Bing Dang, Dennis G. Manzer:
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. IBM J. Res. Dev. 52(6): 571-581 (2008)
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