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"Explicit model of thermal stress induced by annular through-silicon-via (TSV)."

Fengjuan Wang, Ningmei Yu (2016)

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DOI: 10.1587/ELEX.13.20160767

access: open

type: Journal Article

metadata version: 2021-02-12

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  dblp key:
  - journals/ieiceee/WangY16a
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  - https://dblp.org/rec/journals/ieiceee/WangY16a
Fengjuan Wang, Ningmei Yu:
Explicit model of thermal stress induced by annular through-silicon-via (TSV). IEICE Electron. Express 13(21): 20160767 (2016)

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