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"A virtual metrology approach for maintenance compensation to improve yield ..."

Kuo-Yi Lin, Chia-Yu Hsu, Hui-Chun Yu (2014)

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DOI: 10.1080/18756891.2014.947116

access: open

type: Journal Article

metadata version: 2018-10-16

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  - journals/ijcisys/LinHY14
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Kuo-Yi Lin, Chia-Yu Hsu, Hui-Chun Yu:
A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing. Int. J. Comput. Intell. Syst. 7(sup2): 66-73 (2014)

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