"The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs."

Jindong Zhou et al. (2023)

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DOI: 10.1016/J.VLSI.2022.09.017

access: closed

type: Journal Article

metadata version: 2022-12-25

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Jindong Zhou, Yuyang Chen, Youliang Jing, Pingqiang Zhou:
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs. Integr. 88: 196-202 (2023)

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