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"Design and Comparison of High-Reliable Radiation-Hardened Flip-Flops Under ..."

Bingbing Xia et al. (2016)

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DOI: 10.1142/S0218126616501632

access: closed

type: Journal Article

metadata version: 2020-08-25

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  - journals/jcsc/XiaWLZM16
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  - https://dblp.org/rec/journals/jcsc/XiaWLZM16
Bingbing Xia, Jun Wu, Hongjin Liu, Kai Zhou, Zhifu Miao:
Design and Comparison of High-Reliable Radiation-Hardened Flip-Flops Under SMIC 40nm Process. J. Circuits Syst. Comput. 25(12): 1650163:1-1650163:19 (2016)

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