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"Low temperature Si/Si wafer direct bonding using a plasma activated method."

Dong-ling Li et al. (2013)

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DOI: 10.1631/JZUS.C12MNT02

access: closed

type: Journal Article

metadata version: 2020-05-13

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  - https://dblp.org/rec/journals/jzusc/LiSWW13
Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen:
Low temperature Si/Si wafer direct bonding using a plasma activated method. J. Zhejiang Univ. Sci. C 14(4): 244-251 (2013)

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