"System on a Package Innovations With Universal Chiplet Interconnect ..."

Debendra Das Sharma (2023)

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DOI: 10.1109/MM.2023.3235770

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type: Journal Article

metadata version: 2023-03-21

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Debendra Das Sharma:
System on a Package Innovations With Universal Chiplet Interconnect Express (UCIe) Interconnect. IEEE Micro 43(2): 76-85 (2023)

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