"Library based macro-modeling methodology for Through Silicon Via (TSV) ..."

Karim Ali et al. (2015)

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DOI: 10.1016/J.MEJO.2015.10.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Karim Ali, Eslam Yahya, Alaa B. El-Rouby, Yehea I. Ismail:
Library based macro-modeling methodology for Through Silicon Via (TSV) arbitrary arrays. Microelectron. J. 46(12): 1291-1303 (2015)

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