"Study on fatigue cracking of through-silicon via structures under thermal ..."

Rui Dong et al. (2025)

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DOI: 10.1016/J.MEJO.2025.106908

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type: Journal Article

metadata version: 2025-10-29

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Rui Dong, Zhiqiang Wang, Chenxu Chen, Salvinder Singh Karam Singh:
Study on fatigue cracking of through-silicon via structures under thermal load based on fatigue indicator parameters. Microelectron. J. 166: 106908 (2025)

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