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"Distribution optimization of thermal through-silicon via for 3D chip based ..."

Xiaonan Guan et al. (2023)

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DOI: 10.1016/J.MEJO.2023.105723

access: closed

type: Journal Article

metadata version: 2023-03-28

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Xiaonan Guan, Kun Xi, Zhihui Xie, Jian Zhang, Zhuoqun Lu, Yanlin Ge:
Distribution optimization of thermal through-silicon via for 3D chip based on thermal-mechanic coupling. Microelectron. J. 134: 105723 (2023)

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