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"A novel simulation methodology for full chip-package thermo-mechanical ..."

Balamurugan Karunamurthy et al. (2014)

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DOI: 10.1016/J.MEJO.2013.12.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mj/KarunamurthyOBM14
Balamurugan Karunamurthy, Thomas Ostermann, Monojit Bhattacharya, Sandipan Maity:
A novel simulation methodology for full chip-package thermo-mechanical reliability investigations. Microelectron. J. 45(7): 966-971 (2014)

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